205 lines
4.8 KiB
Plaintext
205 lines
4.8 KiB
Plaintext
{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "8.0.0"
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},
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"CreationDate": "2024-03-06T22:08:18-05:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "Sentinel 65X - Prototype 4",
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"GUID": "53656e74-696e-4656-9c20-363558202d20",
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"Revision": "rev?"
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},
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"Size": {
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"X": 169.0525,
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"Y": 179.17
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},
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"LayerNumber": 6,
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"BoardThickness": 1.6,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.15,
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"PadToTrack": 0.15,
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"TrackToTrack": 0.15,
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"MinLineWidth": 0.15,
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"TrackToRegion": 0.5,
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"RegionToRegion": 0.5
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},
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{
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"Layers": "Inner",
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"PadToPad": 0.15,
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"PadToTrack": 0.15,
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"TrackToTrack": 0.15,
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"MinLineWidth": 0.15,
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"TrackToRegion": 0.5,
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"RegionToRegion": 0.5
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}
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],
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"FilesAttributes": [
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{
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"Path": "Sentinel 65X - Prototype 4-F_Cu (SMD).gbr",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-In1_Cu (GND).gbr",
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"FileFunction": "Copper,L2,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-In2_Cu (N-S).gbr",
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"FileFunction": "Copper,L3,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-In3_Cu_ (E-W).gbr",
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"FileFunction": "Copper,L4,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-In4_Cu (GND).gbr",
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"FileFunction": "Copper,L5,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-B_Cu (MISC).gbr",
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"FileFunction": "Copper,L6,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-F_Paste.gbr",
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"FileFunction": "SolderPaste,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-B_Paste.gbr",
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"FileFunction": "SolderPaste,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-F_Silkscreen.gbr",
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"FileFunction": "Legend,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-B_Silkscreen.gbr",
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"FileFunction": "Legend,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-F_Mask.gbr",
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-B_Mask.gbr",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "Sentinel 65X - Prototype 4-Edge_Cuts.gbr",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu (SMD)"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.1,
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"Material": "FR4",
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"Name": "F.Cu (SMD)/In1.Cu (GND)",
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"Notes": "Type: dielectric layer 1 (from F.Cu (SMD) to In1.Cu (GND))"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "In1.Cu (GND)"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.535,
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"Material": "FR4",
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"Name": "In1.Cu (GND)/In2.Cu (N-S)",
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"Notes": "Type: dielectric layer 2 (from In1.Cu (GND) to In2.Cu (N-S))"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "In2.Cu (N-S)"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.1,
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"Material": "FR4",
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"Name": "In2.Cu (N-S)/In3.Cu. (E-W)",
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"Notes": "Type: dielectric layer 3 (from In2.Cu (N-S) to In3.Cu. (E-W))"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "In3.Cu. (E-W)"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.535,
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"Material": "FR4",
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"Name": "In3.Cu. (E-W)/In4.Cu (GND)",
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"Notes": "Type: dielectric layer 4 (from In3.Cu. (E-W) to In4.Cu (GND))"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "In4.Cu (GND)"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.1,
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"Material": "FR4",
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"Name": "In4.Cu (GND)/B.Cu (MISC)",
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"Notes": "Type: dielectric layer 5 (from In4.Cu (GND) to B.Cu (MISC))"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu (MISC)"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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